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LDIP-IPM IM13400
Description
Cyntec IPM is integrated drive, protection and system control functions that is designed for high performance 3-phase motor driver application like Home appliances applications. Inverter drive parts for AC/DC motor driving.
Features
High latch-up immunity. Low switching loss and higher short-circuit withstanding capability. Low temperature coefficient effect both for driver and IGBT. Integrated driver IC to reduce the PCB size and layout effort. High noise rejection capability. Under-voltage lockout protection both for high and low side IGBT. High Vcc and Input signal port voltage rating. Good thermal performance. Matched propagation delay for three arms. Automatic shut-off the high and low side IGBT to avoid shoot-through conduction in case the driving signal is abnormal. Provided a fault signal (FO pin) and shut-off internal IGBT, when OC/SC and under-voltage situation are occurred.
TERMINAL CODE 14 VCC 1 HIN1 15 GND 2 VCC 3 VB1 16 CIN 4 VS1 17 CFO 5 HIN2 18 FO 6 VCC 19 LIN1 7 VB2 20 LIN2 8 VS2 21 LIN3 9 HIN3 22 P 10 VCC 23 U 11 VSS 24 V 12 VB3 25 W 13 VS3 26 N
1~5
1
1
lrrgulor solder remains
lrrgulor solder remains
HEAT SINK SIDE
Detail A
Stand off
Detail B (t=0.7)
Stand off
Detail C (t=0.7)
Figure 1. Package Outlines
UNLESS OTHERWISE SPECIFIED TOLERQNCES ON X = X.X = X.XX = ANGLES HOLE DIA. DRAWN DESIGNED CHECKED APPROVED SCALE X BY BY BY BY UNIT X
THIS DRAWINGS AND SPECIFICATIONS ARE THE PROPERTY OF CYNTEC CO., LTD. AND SHALL NOT BE REPRODUCED OR USED AS THE BASIS FOR THE MANUFACTURE OR SALE OF APPARATUS OR DEVICES WITHOUT PERMISSION
CYNTEC CO., LTD.
DOCUMENT NO.
PAGE REV.
TITLE: ENGINEERING SPEC. OF LDIP IPM 600V 20A
IM13400
PAGE 1
A6 OF 1
Table 1.
No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 Symbol HIN1 VCC VB1 VS1 HIN2 VCC VB2 VS2 HIN3 VCC GND VB3 VS3 VCC GND CIN CFO FO LIN1 LIN2 LIN3 P U V W N
Pin Descriptions
Pin Description
Signal Input Terminal for High-side U Phase Supply Voltage Terminal for Driver IC High -side Bias Voltage for U Phase IGBT Driving High -side Bias Voltage Ground for U Phase IGBT Driving Signal Input Terminal for High-side V Phase Supply Voltage Terminal for Driver IC High -side Bias Voltage for V Phase IGBT Driving High -side Bias Voltage Ground for V Phase IGBT Driving Signal Input Terminal for High-side W Phase Supply Voltage Terminal for Driver IC Signal Ground High -side Bias Voltage for W Phase IGBT Driving High -side Bias Voltage Ground for W Phase IGBT Driving Supply Voltage Terminal for Driver IC Signal Ground Comparator Input Capacitor for Fault Output Duration Time Selection Fault Output Terminal Signal Input Terminal for Low-side U Phase Signal Input Terminal for Low-side V Phase Signal Input Terminal for Low-side W Phase Positive DC-Bus Input Terminal Output Terminal for U Phase Output Terminal for V Phase Output Terminal for W Phase Negative DC-Bus Input Terminal
UNLESS OTHERWISE SPECIFIED TOLERQNCES ON X = X.X = X.XX = ANGLES HOLE DIA.
DRAWN DESIGNED CHECKED APPROVED SCALE
BY BY BY BY X UNIT X
CYNTEC CO., LTD.
THIS DRAWINGS AND SPECIFICATIONS ARE THE PROPERTY OF CYNTEC CO., LTD. AND SHALL NOT BE REPRODUCED OR USED AS THE BASIS FOR THE MANUFACTURE OR SALE OF APPARATUS OR DEVICES WITHOUT PERMISSION
TITLE: ENGINEERING SPEC. OF LDIP IPM 600V 20A
DOCUMENT NO.
IM13400
PAGE 2
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LDIP-IPM Internal Block Diagram
4 3 2 8 7 13 12 6 1 5 9
VS1 VB1 VCC VS2 VB2 VS3 VB3 VCC HIN1 HIN2 HIN3 LIN1 LIN2 LIN3 FO VCC GND
22
P U
Signal Input Gate Driver Circuit Fault Logic Protection Circuit Supply Circuit
Q1
D1
23
+5V Logic
19 20 21 18 10
D2 Q2
24
V
MOTOR
D3 Q3 D4 Q4
25
W
11
14
VCC
D5
+15V
Q5
D6 Q6
26
15
GND
17
N
CFO
CIN
16
Shunt Resistor
Figure 2. LDIP-IPM Internal Block Diagram
UNLESS OTHERWISE SPECIFIED TOLERQNCES ON X = X.X = X.XX = ANGLES HOLE DIA.
DRAWN DESIGNED CHECKED APPROVED SCALE
BY BY BY BY X UNIT X
CYNTEC CO., LTD.
THIS DRAWINGS AND SPECIFICATIONS ARE THE PROPERTY OF CYNTEC CO., LTD. AND SHALL NOT BE REPRODUCED OR USED AS THE BASIS FOR THE MANUFACTURE OR SALE OF APPARATUS OR DEVICES WITHOUT PERMISSION
TITLE: ENGINEERING SPEC. OF LDIP IPM 600V 20A
DOCUMENT NO.
IM13400
PAGE 3
PAGE REV.
A6 OF 3
MAXIMUM RATINGS (Tj = 25)
INVERTER PART
Item Between collector to emitter voltage Each IGBT collector current Each IGBT collector current (peak) Junction temperature Symbol VCES IC ( Tc = 25 ) ICP ( Tc = 25, pulse ) Tj Min. -20 Max. 600 20 40 +150 Unit V A A
CONTROL PART
Item Driver IC supply voltage P- side floating supply voltage Current sensing input voltage Logic input voltage Fault output voltage Symbol VCC VB1S1,B2S2,B3S3 VCIN HIN1,HIN2,HIN3, LIN1,LIN2,LIN3 VFO Min. -0.3 -0.3 -0.3 -0.3 -0.3 Max. 25 20 25 25 25 Unit V V V V V
TOTAL SYSTEM
Item Module case operating temperature Storage temperature Isolation voltage (60Hz Sinusoidal, AC 1 minute, pins to heat-sink plate) Note 1Tc Measurement Point. Symbol TC Tstg Viso (Note 1) Min. -20 -40 Max. +100 +150 2500 Unit Vrms
Control Terminals
Heat sink boundary
Tc Power Terminals
Heat sink
Tc
Figure 3. Tc Measurement Point
UNLESS OTHERWISE SPECIFIED TOLERQNCES ON X = X.X = X.XX = ANGLES HOLE DIA.
DRAWN DESIGNED CHECKED APPROVED SCALE
BY BY BY BY X UNIT X
CYNTEC CO., LTD.
THIS DRAWINGS AND SPECIFICATIONS ARE THE PROPERTY OF CYNTEC CO., LTD. AND SHALL NOT BE REPRODUCED OR USED AS THE BASIS FOR THE MANUFACTURE OR SALE OF APPARATUS OR DEVICES WITHOUT PERMISSION
TITLE: ENGINEERING SPEC. OF LDIP IPM 600V 20A
DOCUMENT NO.
IM13400
PAGE 4
PAGE REV.
A6 OF 4
ELECTRICAL CHARACTERISTICS (Tj = 25)
INVERTER PART
Item Collector-emitter saturation voltage FWD forward voltage drop Switching times (Fig. 4) Collector-emitter cut-off current Symbol VCE (sat) VF Ton Tr Toff Tf ICES Condition = VB1S1,B2S2,B3S3 = 15V, VCC IC =20A, VCIN = 0V Tj = 25, - IC = 20A, VCIN = 5V VD = 300V, VCC = VB1S1,B2S2,B3S3 = 15V, IC = 20A, Tj =25, VHIN =5V<> 0V, VCIN = 0V, Inductive Load VCE =VCES Min. Tj=25 Typ. 2.3 2.0 0.6 0.06 1.0 0.05 Max. 2.8 2.4 0.8 0.12 1.2 0.1 0.32 mA s Unit V V
Figure 4. Switching Time Define
UNLESS OTHERWISE SPECIFIED TOLERQNCES ON X = X.X = X.XX = ANGLES HOLE DIA.
DRAWN DESIGNED CHECKED APPROVED SCALE
BY BY BY BY X UNIT X
CYNTEC CO., LTD.
THIS DRAWINGS AND SPECIFICATIONS ARE THE PROPERTY OF CYNTEC CO., LTD. AND SHALL NOT BE REPRODUCED OR USED AS THE BASIS FOR THE MANUFACTURE OR SALE OF APPARATUS OR DEVICES WITHOUT PERMISSION
TITLE: ENGINEERING SPEC. OF LDIP IPM 600V 20A
DOCUMENT NO.
IM13400
PAGE 5
PAGE REV.
A6 OF 5
Test conditionVdc =300V, Ic = 20A, Vcc = 15V, Vin = 0V5V (Inductive Load), TC = 25
Vce(100V/div)
Ic(5A/div)
Figure 5. Testing Switching Waveform
CONTROL PART (Tj = 25)
Item HIN1,2,3 , LIN1,2,3 ON threshold voltage HIN1,2,3 , LIN1,2,3 OFF threshold voltage HIN1,2,3 input current LIN1,2,3 input current Driver IC supply voltage P-side floating supply voltage VCC terminal input current Fault output voltage Short circuit trip level Fault output pulse width Supply circuit under voltage protection Symbol Vth(on) Vth(off) IHIN(HI) IHIN(LO) ILIN(HI) ILIN(LO) VCC VB1S1,B2S2,B3S3 IC VFOH VFOL VSC(ref) tFO UVTVCC UVRVCC UVH VHIN1,2,3 = 5V VHIN1,2,3 = 0V VLIN1,2,3 = 5V VLIN1,2,3 = 0V Condition Min. 1.42.2 13.5 13.5 4.9 0.37 10.4 10.6 Typ. 1.7 2.5 15.0 15.0 0.46 1.8 10.9 11.1 0.2 Max. 2.0 2.8 220 300 220 300 16.5 16.5 2.3 200 0.55 11.4 11.6 Unit V V A A V V mA V mV V ms V V V
VCIN =0V VCIN =1V VCC=15V, Tj = 25 CF O =22nF ~ 33nF Trip level Reset level Hysteresis
(Note 2) (Note 2) (Note 3)
Note 2 : FO output is open collector type, so this signal line should be pulled up to the +5V power supply with approximately 5.1K. Note 3CFO need to adjust if output can not fit 1.8 ms demand.
UNLESS OTHERWISE SPECIFIED TOLERQNCES ON X = X.X = X.XX = ANGLES HOLE DIA.
DRAWN DESIGNED CHECKED APPROVED SCALE
BY BY BY BY X UNIT X
CYNTEC CO., LTD.
THIS DRAWINGS AND SPECIFICATIONS ARE THE PROPERTY OF CYNTEC CO., LTD. AND SHALL NOT BE REPRODUCED OR USED AS THE BASIS FOR THE MANUFACTURE OR SALE OF APPARATUS OR DEVICES WITHOUT PERMISSION
TITLE: ENGINEERING SPEC. OF LDIP IPM 600V 20A
DOCUMENT NO.
IM13400
PAGE 6
PAGE REV.
A6 OF 6
THERMAL RESISTANCE
Item Junction to case thermal resistance Symbol Rth(j-c)Q Rth(j-c)F Condition IGBT part (1/6) FWD part (1/6) Min. Typ. Max. 1.1 1.6 Unit /W
RECOMMENDED OPERATION CONDITIONS
Item DC_ Link Supply voltage Control supply voltage Control supply voltage Input ON threshold voltage Input OFF threshold voltage Supply voltage ripple Arm shoot-through blocking time PWM Input frequency Symbol VD VCC VB1S1,B2S2,B3S3 VCIN(ON) VCIN(OFF) VD , VDB t dead fPWM TC100, Tj125 Condition Applied between P-N Applied between VCC - GND Applied between VB1,2,3 - VS1,2,3 Applied between HIN1,2,3 - GND and LIN1,2,3 - GND (Note 4) Min. 0 13.5 13.5 Typ. Max. 300 400 15.0 16.5 15.0 16.5 0 ~ 0.65 4.0 ~ 5.5 1 15 Unit V V V V V V/s s kHz
-1 2 -
Note 4To prevent high and low side IGBT occurred shoot-through.
MECHANICAL CHARACTERISTICS AND RATINGS
Item Mounting torque Weight Heat-sink flatness Condition Mounting screwM4 (Note 5) Min. Recommended 1.18 N*m --0.98 -50 Typ. 1.18 75 Max. 1.37 100 Unit N-m g m
Note 5Measurement point of heat-sink flatness.
DIP-IPM Measurement point
Place to contact a heat sink Heat sink
Heat sink
Figure 6. Measurement Point of Heat-sink Flatness
UNLESS OTHERWISE SPECIFIED TOLERQNCES ON X = X.X = X.XX = ANGLES HOLE DIA.
DRAWN DESIGNED CHECKED APPROVED SCALE
BY BY BY BY X UNIT X
CYNTEC CO., LTD.
THIS DRAWINGS AND SPECIFICATIONS ARE THE PROPERTY OF CYNTEC CO., LTD. AND SHALL NOT BE REPRODUCED OR USED AS THE BASIS FOR THE MANUFACTURE OR SALE OF APPARATUS OR DEVICES WITHOUT PERMISSION
TITLE: ENGINEERING SPEC. OF LDIP IPM 600V 20A
DOCUMENT NO.
IM13400
PAGE 7
PAGE REV.
A6 OF 7
Input/Output Timing Diagram
Figure 7. Input/Output Timing Diagram
Note 6The shaded area indicates that both high-side and low-side switches are off and therefore the half-bridge output voltage would be determined by the direction of current flow in the load.
Figure 8. Input/Output Signal Circuit
UNLESS OTHERWISE SPECIFIED TOLERQNCES ON X = X.X = X.XX = ANGLES HOLE DIA.
DRAWN DESIGNED CHECKED APPROVED SCALE
BY BY BY BY X UNIT X
CYNTEC CO., LTD.
THIS DRAWINGS AND SPECIFICATIONS ARE THE PROPERTY OF CYNTEC CO., LTD. AND SHALL NOT BE REPRODUCED OR USED AS THE BASIS FOR THE MANUFACTURE OR SALE OF APPARATUS OR DEVICES WITHOUT PERMISSION
TITLE: ENGINEERING SPEC. OF LDIP IPM 600V 20A
DOCUMENT NO.
IM13400
PAGE 8
PAGE REV.
A6 OF 8
LDIP-IPM Short-Circuit Protection Function
S1. Normal operationIGBT ON and carrying current. S2. Short circuit current detection (SC trigger). S3. IGBT gate interrupt and FO signal starts. S4. IGBT turns OFF. S5. IGBT OFF state. S6. FO signal reset. S7. Normal operation.
Figure 9. Timing Chart of SC Operation
UNLESS OTHERWISE SPECIFIED TOLERQNCES ON X = X.X = X.XX = ANGLES HOLE DIA.
DRAWN DESIGNED CHECKED APPROVED SCALE
BY BY BY BY X UNIT X
CYNTEC CO., LTD.
THIS DRAWINGS AND SPECIFICATIONS ARE THE PROPERTY OF CYNTEC CO., LTD. AND SHALL NOT BE REPRODUCED OR USED AS THE BASIS FOR THE MANUFACTURE OR SALE OF APPARATUS OR DEVICES WITHOUT PERMISSION
TITLE: ENGINEERING SPEC. OF LDIP IPM 600V 20A
DOCUMENT NO.
IM13400
PAGE 9
PAGE REV.
A6 OF 9
LDIP-IPM Under-Voltage Protection Function
S1. Normal operationIGBT ON and carrying current. S2. Under-Voltage detection. S3. IGBT gate interrupt. S4. IGBT OFF state. S5. Under-Voltage reset. S6. Normal operation.
Figure 10. Timing Chart of Under-Voltage Operation
Recommended CPU I/O Interface Circuit
Figure 11. I/O Interface Circuit
Note 7Depending on the wiring impedances and the PWM control circuit of the application's PCB, the RC coupling at each input may be changed.
UNLESS OTHERWISE SPECIFIED TOLERQNCES ON X = X.X = X.XX = ANGLES HOLE DIA.
DRAWN DESIGNED CHECKED APPROVED SCALE
BY BY BY BY X UNIT X
CYNTEC CO., LTD.
THIS DRAWINGS AND SPECIFICATIONS ARE THE PROPERTY OF CYNTEC CO., LTD. AND SHALL NOT BE REPRODUCED OR USED AS THE BASIS FOR THE MANUFACTURE OR SALE OF APPARATUS OR DEVICES WITHOUT PERMISSION
TITLE: ENGINEERING SPEC. OF LDIP IPM 600V 20A
DOCUMENT NO.
IM13400
PAGE 10
PAGE REV.
A6 OF 10
Recommended Circuit Example When Using a Photo Coupler
5V
5V
15V
Vcc P
Microcomputer
IN
GND
N
(a) IPM input pin (high-side 3-phase and low-side 3-phase)
5V
15V
Vcc P
Microcomputer
FO
N
GND
(b) Fault output pin
Figure 12. I/O Interface Circuit When Using Photo Coupler
UNLESS OTHERWISE SPECIFIED TOLERQNCES ON X = X.X = X.XX = ANGLES HOLE DIA.
DRAWN DESIGNED CHECKED APPROVED SCALE
BY BY BY BY X UNIT X
CYNTEC CO., LTD.
THIS DRAWINGS AND SPECIFICATIONS ARE THE PROPERTY OF CYNTEC CO., LTD. AND SHALL NOT BE REPRODUCED OR USED AS THE BASIS FOR THE MANUFACTURE OR SALE OF APPARATUS OR DEVICES WITHOUT PERMISSION
TITLE: ENGINEERING SPEC. OF LDIP IPM 600V 20A
DOCUMENT NO.
IM13400
PAGE 11
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A6 OF 11
Direct Input (without Photo-Coupler) Interface Example
+5V R2x6
D1 D1 D1
C5 R3 C5 R3 C5 R3
C2 C2
4 3 2 8 7 13 12 6 1 5 9 19 20 21 18
M C U
R1
C2
VS1 VB1 VCC VS2 VB2 VS3 VB3 VCC HIN1 HIN2 HIN3 LIN1 LIN2 LIN3 FO VCC GND
22
P U
Signal Input Gate Driver Circuit Fault Logic Protection Circuit Supply Circuit
23
24
V MOTOR W
C1 C1 C1 C1 C1 C1 +15V
10
25
11
14
VCC
15
GND
17
26
N
CFO
CIN C4
16
C3
R4
Shunt Resistor
Figure 13. Typical Application Circuit Interface Example with Direct Input
Component selection : 1. R15.1K ( FO output is open collector type. It is necessary to apply a resistor. ) 2. R24.7K 3. R320 ( It could be adjusted depending on the PWM frequency. ) 4. R4100 ( Recommended the time constant R4xC4 is 2S. ) 5. C1100 ~ 1000pF ( Ceramic ) ( The capacitor could filter the noise, but should be careful to the dead time) 6. C210 ~ 100F ( Electrolytic, low impendence ) 7. C322nF ( Ceramic ) 8. C40.02F ( Ceramic ) 9. C50.22 ~ 2F ( Ceramic ) 10. D1600V/1A ( Ultra-Fast recovery diode )
UNLESS OTHERWISE SPECIFIED TOLERQNCES ON X = X.X = X.XX = ANGLES HOLE DIA.
DRAWN DESIGNED CHECKED APPROVED SCALE
BY BY BY BY X UNIT X
CYNTEC CO., LTD.
THIS DRAWINGS AND SPECIFICATIONS ARE THE PROPERTY OF CYNTEC CO., LTD. AND SHALL NOT BE REPRODUCED OR USED AS THE BASIS FOR THE MANUFACTURE OR SALE OF APPARATUS OR DEVICES WITHOUT PERMISSION
TITLE: ENGINEERING SPEC. OF LDIP IPM 600V 20A
DOCUMENT NO.
IM13400
PAGE 12
PAGE REV.
A6 OF 12
Interface Example when a Photo-Coupler is used
+5V R2 U1 R5 R2 U1 R5 R2 R1 Q1 C1 D1 R1 Q1 C1 R1 Q1 C1 R7 U1
14
C5 R3 C5 R3 C5 R3
C2 C2 C2
4 3 2 8 7 13 12 6 1 5 9 19 20 21 18 10
D1 D1
VS1 VB1 VCC VS2 VB2 VS3 VB3 VCC HIN1 HIN2 HIN3 LIN1 LIN2 LIN3 FO VCC GND
22
P U
Signal Input Gate Driver Circuit Fault Logic Protection Circuit Supply Circuit
23
M C U
C6 U1 R5 R6
24
V MOTOR W
25
11
VCC
R2 U1 R5 R2 U1 R5 R2 U1 R5
R1 Q1 C1 +15V
15
GND
17
26
N
R1 Q1 C1 +5V R1 Q1 C1 CFO CIN C4
16
C3
R4
Shunt Resistor
Figure 14. Typical Application Circuit Interface Example with Photo Coupler Component selection : 1. R14.7K 2. R2150 3. R320 ( It could be adjusted depending on the PWM frequency. ) 4. R4100 ( Recommended the time constant R4xC4 is 2S. ) 5. R51K 6. R61K 7. R71K 8. C10.1F 9. C210 ~ 100F ( Electrolytic, low impendence ) 10. C322nF ( Ceramic ) 11. C40.02F ( Ceramic ) 12. C50.22 ~ 2F ( Ceramic ) 13. C60.1F 14. D1600V/1A ( Ultra-Fast recovery diode ) 15. Q1NPN transistor 2N3904 16. U1Photo coupler TLP521
UNLESS OTHERWISE SPECIFIED TOLERQNCES ON X = X.X = X.XX = ANGLES HOLE DIA.
DRAWN DESIGNED CHECKED APPROVED SCALE
BY BY BY BY X UNIT X
CYNTEC CO., LTD.
THIS DRAWINGS AND SPECIFICATIONS ARE THE PROPERTY OF CYNTEC CO., LTD. AND SHALL NOT BE REPRODUCED OR USED AS THE BASIS FOR THE MANUFACTURE OR SALE OF APPARATUS OR DEVICES WITHOUT PERMISSION
TITLE: ENGINEERING SPEC. OF LDIP IPM 600V 20A
DOCUMENT NO.
IM13400
PAGE 13
PAGE REV.
A6 OF 13
Precautions on Electrostatic Electricity (1) Operators must wear anti-static clothing and conductive shoes (or a leg or heel strap). (2) Operators must wear a wrist strap grounded to earth via a resistor of about 1 M. (3) Soldering irons must be grounded from iron tip to earth, and must be used only at low voltages. (4) If the tweezers you use are likely to touch the device terminals, use anti-static tweezers and in particular avoid metallic tweezers. If a charged device touches a low-resistance tool, rapid discharge can occur. When using vacuum tweezers, attach a conductive chucking pat to the tip, and connect it to a dedicated ground used especially for anti-static purposes (suggested resistance value: 104 to 108). (5) Do not place devices or their containers near sources of strong electrical fields (such as above a CRT). (6) When storing printed circuit boards which have devices mounted on them, use a board container or bag that's protected against static charge. To avoid the occurrence of static charge or discharge due to friction, keep the boards separate from one other and do not stack them directly on top of one another. (7) Ensure, if possible, that any articles (such as clipboards) which are brought to any location where the level of static electricity must be closely controlled are constructed of anti-static materials. (8) In cases where the human body comes into direct contact with a device, be sure to wear anti-static finger covers or gloves (suggested resistance value: 108 or less). (9) Equipment safety covers installed near devices should have resistance ratings of 109 or less. (10) If a wrist strap cannot be used for some reason, and there is a possibility of imparting friction to devices, use an ionizer.
UNLESS OTHERWISE SPECIFIED TOLERQNCES ON X = X.X = X.XX = ANGLES HOLE DIA.
DRAWN DESIGNED CHECKED APPROVED SCALE
BY BY BY BY X UNIT X
CYNTEC CO., LTD.
THIS DRAWINGS AND SPECIFICATIONS ARE THE PROPERTY OF CYNTEC CO., LTD. AND SHALL NOT BE REPRODUCED OR USED AS THE BASIS FOR THE MANUFACTURE OR SALE OF APPARATUS OR DEVICES WITHOUT PERMISSION
TITLE: ENGINEERING SPEC. OF LDIP IPM 600V 20A
DOCUMENT NO.
IM13400
PAGE 14
PAGE REV.
A6 OF 14

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